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LEE JUN-DER

Overview
  • Total Patents
    11
About

LEE JUN-DER has a total of 11 patent applications. Its first patent ever was published in 2008. It filed its patents most often in United States. Its main competitors in its focus markets materials and metallurgy, machine tools and semiconductors are NIPPON MICROMETAL CORP, NIPPON STEEL SUMIKIN MATERIALS CO LTD and ORTHODYNE ELECTRONICS CORP.

Patent filings in countries

World map showing LEE JUN-DERs patent filings in countries
# Country Total Patents
#1 United States 11

Patent filings per year

Chart showing LEE JUN-DERs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Jun-Der 11
#2 Tsai Hsing-Hua 2
#3 Chuang Tung-Han 2

Latest patents

Publication Filing date Title
US2013164169A1 Composite alloy bonding wire
US2013160902A1 Manufacturing method for composite alloy bonding wire
US2013171470A1 Alloy wire and methods for manufacturing the same
US2012093681A1 Composite alloy bonding wire and manufacturing method thereof
US2010239456A1 Composite alloy bonding wire and manufacturing method thereof
US2010239455A1 Composite alloy bonding wire and manufacturing method thereof
US2009297391A1 Manufacturing method for a silver alloy bonding wire and products thereof
US2009191088A1 Manufacturing method for a composite metal bonding wire and products thereof
US2009191424A1 Manufacturing method for a composite metal wire used as a packaging wire and products thereof