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KULICKE & SOFFA DIE BONDING GMBH

Overview
  • Total Patents
    28
About

KULICKE & SOFFA DIE BONDING GMBH has a total of 28 patent applications. Its first patent ever was published in 1999. It filed its patents most often in EPO (European Patent Office), China and Republic of Korea. Its main competitors in its focus markets semiconductors, machines and packaging and shipping are FUTRFAB INC, UNI TEK SYSTEM INC and GLOBALFOUNDRIES SINGAPORE PTE.

Patent filings per year

Chart showing KULICKE & SOFFA DIE BONDING GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schuster Johannes 13
#2 Trinks Joachim 7
#3 Marte Andreas 6
#4 Stadelmann Tim 3
#5 Ernst Urban 3
#6 Ernst Urban Georg 2
#7 Stadelmann Tim Oliver 2
#8 Mulken Frans Van 1
#9 Huebner Holger 1
#10 Wong Kam Shing 1

Latest patents

Publication Filing date Title
CH705370A1 Method and apparatus for inspection of a semiconductor chip before assembly.
WO2011089201A1 A tool tip for a die placement tool
EP2296168A1 Tool for picking a planar object from a supply station
EP2381465A1 Tool tip interface for a die handling tool
KR20110059713A A method for controlling the movement of an apparatus, in particular a place tool of a die bonder
CN105810611A Rotatable, heatable placement tool and chip mounting system comprising such a placement tool
EP2335329A1 Apparatus for manipulating objects, in particular semiconductor chips, and a flexible flat cable
EP2284863A1 Method and apparatus for inspecting a chip prior to bonding
EP2126645A1 Method for calibrating the x-y positioning of a positioning tool, and apparatus with such a positioning tool
EP1030349A2 Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips