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UNI TEK SYSTEM INC

Overview
  • Total Patents
    17
About

UNI TEK SYSTEM INC has a total of 17 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Taiwan, United States and Germany. Its main competitors in its focus markets semiconductors, control and machines are GLOBALFOUNDRIES SINGAPORE PTE, INOTERA MEMORIES INC and WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO L.

Patent filings in countries

World map showing UNI TEK SYSTEM INCs patent filings in countries
# Country Total Patents
#1 Taiwan 9
#2 United States 4
#3 Germany 2
#4 China 1
#5 Republic of Korea 1

Patent filings per year

Chart showing UNI TEK SYSTEM INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shiu Chiou-Tian 6
#2 Tsai Ching-Yi 4
#3 Hung Yu-Min 3
#4 Pan De-En 3
#5 Lai Neng-Huei 3
#6 Hsu Chiu-Tien 3
#7 Seng Wei-Chun 2
#8 Hong Dick 2
#9 Lai Yun-Jin 2
#10 Pan Dean 2

Latest patents

Publication Filing date Title
KR20050023159A Method of producing integrated circuit package units
TW200507083A Polishing method for cutter of wafer scribing machine
TW200507090A On-line alternate dicing method and cutter polishing method of wafer dicing machine
CN1567565A Method for cutting array type workpiece having metallic layer partition way
DE10253250A1 Automatic precision alignment method for a semiconductor wafer cutter
DE10252986A1 An angle control device comprising a display device configured with two viewports simultaneously displaying the same image captured by a single camera
US7054477B2 Automatic accurate alignment method for a semiconductor wafer cutting apparatus
TW559937B Dicing process flow with forced rotation of wafer
TW586172B Automatic alignment and sampling method for array-type workpieces with symmetrical lightening patterns
TWI225666B Method for deciding cutting mode by wafer side locating
TW560026B Singulation method of the array-type work piece to be singulated having metal layer singulation street, and the array-type work piece to be singulated applying the method
TW516079B Alignment system with single camera lens and dual window
TW516152B Method for finding wafer boundary
TW516153B Method of automatically aligning wafer
US6371102B1 Device for cutting interconnected rectangular plate-shaped workpieces into a plurality or individual rectangular units
US6318354B1 Singulation system for a BGA product