| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 3 | |
| #2 | Republic of Korea | 3 | |
| #3 | Philippines | 3 | |
| #4 | Singapore | 3 | |
| #5 | United States | 3 | |
| #6 | WIPO (World Intellectual Property Organization) | 3 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Audio-visual technology | |
| #4 | Control |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Control or regulating systems | |
| #3 | Casings and printed circuits | |
| #4 | Electric motor controls |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yu Feng | 18 |
| #2 | Wang Hong Gang | 18 |
| #3 | Li Yang | 18 |
| #4 | Wang Yong Xin | 12 |
| #5 | Wang Min | 6 |
| Publication | Filing date | Title |
|---|---|---|
| WO2018064813A1 | Semiconductor packaging device and control method and control apparatus thereof | |
| WO2017156671A1 | Chip packaging apparatus and method thereof | |
| SG11201806262VA | Apparatus and method for packaging components |