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KAIJO KK

Overview
  • Total Patents
    1,198
  • GoodIP Patent Rank
    16,808
  • Filing trend
    ⇩ 55.0%
About

KAIJO KK has a total of 1,198 patent applications. It decreased the IP activity by 55.0%. Its first patent ever was published in 1986. It filed its patents most often in Japan, United States and Taiwan. Its main competitors in its focus markets semiconductors, machine tools and chemical engineering are SHINKAWA KK, DONOFRIO MATTHEW and KULICKE & SOFFA INVEST.

Patent filings per year

Chart showing KAIJO KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hashimoto Yoshiki 58
#2 Miyoshi Hideaki 44
#3 Okano Katsuichi 44
#4 Shimizu Kazuyoshi 39
#5 Ura Masanao 38
#6 Hasegawa Hiroshi 32
#7 Osawa Tadayasu 32
#8 Ishii Yukinobu 30
#9 Soejima Junichiro 27
#10 Koyama Kenichi 26

Latest patents

Publication Filing date Title
WO2020208850A1 Method of joining insulated coating wire, connection structure, and peeling method and bonding device for insulated coating wire
WO2020255180A1 Wire bonding method and wire bonding apparatus
WO2020039566A1 Wire bonding method and wire bonding apparatus
CN110419230A Ultrasonic vibrator and the ultrasonic cleansing device for using ultrasonic vibrator
JP2019076847A Ultrasonic cleaning apparatus and ultrasonic cleaning system
US2019315049A1 Three-dimensional shaped object production device and three-dimensional shaped object production method
JP2018026473A Bonding method
JP2017216417A Bonding device, bonding method and bonding control program
WO2017109990A1 Wire bonding apparatus
JP2017112260A Capillary conveyance device, capillary attachment device, capillary exchange device, capillary conveyance method, capillary attachment method and capillary exchange method
WO2016178285A1 Ball forming device for wire bonder
JP2016200402A Measurement system and measurement method
JP2016039221A Bonding method and bonding device
JP2015216227A Bonding device
JP2015177046A Bonding device
JP2015103604A Bonding device
JP2015093225A Ultrasonic cleaning apparatus, and ultrasonic cleaning method
JP2015060997A Die bonding device
JP2015047667A Drive mechanism and production device
JP2015013250A Ultrasonic cleaning device and method