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JOW EN-MIN

Overview
  • Total Patents
    39
About

JOW EN-MIN has a total of 39 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States, Taiwan and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, computer technology and telecommunications are JOW EN MIN, ZAKEL ELKE and CHINA WAFER LEVEL CSP CO LTD.

Patent filings in countries

World map showing JOW EN-MINs patent filings in countries
# Country Total Patents
#1 United States 23
#2 Taiwan 15
#3 EPO (European Patent Office) 1

Patent filings per year

Chart showing JOW EN-MINs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jow En-Min 39
#2 Pua Khein-Seng 1
#3 Hung Yung-Ching 1

Latest patents

Publication Filing date Title
US2013278620A1 Method of storing videos and portable device
US2013262879A1 Secure type storage device and information security system
US2013262764A1 Multi-interface memory card and read/write device and system thereof
US2013250140A1 Composite memory card and dedicated reader
TW201201450A Memory element having wireless recognition function and portable electronic device integrating the same
US2009278749A1 Decoration Structure with Loop Antenna
TW201003803A Method for repositioning conductive contact of semiconductor component and semiconductor device thereof
TW200935584A Solid state disk packaging structure and its packaging method
TW200933758A Semiconductor package with antenna and manufacture method thereof
TW200933859A Electromagnetic shilding structure and method for multi-chip package module
US2008310653A1 Digital audio signal amplifier
TW200913173A Memory card
EP2028875A1 Digital audio signal amplifier
TW200905835A Connector with build-in control unit and its application
TW200905834A Memory card and package structure of memory thereof
TW200845213A Semiconductor fabrication method and structure thereof
TW200843077A Package structure of memory
TW200840163A Memory card, memory card connector and memory device of its combination
TW200824053A Package structure of memory card and manufacturing method thereof
US2008067641A1 Package semiconductor and fabrication method thereof