Ceramic substrate assembly having metallic thermal conductive bump pad, element and manufacturing method wherein the ceramic substrate element includes a ceramic substrate body, at least one metal bump pad and a die bonding layer
TW202027988A
Ceramic substrate assembly and component having metallic heat-conductive bump pad and manufacturing method thereof for alleviating thermal stress crack at interface between thin bonding layer and ceramic substrate
TW202023154A
Motor control device with built-in shunt resistor and power transistor capable of miniaturizing the shunt resistor and improving the heat dissipation efficiency through surface-mount welding
TW201904365A
Built-in longitudinal heat dissipation ceramic block printed circuit board and circuit component having the same
TW201622082A
Heterogeneous bonding heat-dissipation substrate with thick metal plate layer
CN103094464A
High thermal conductivity baseboard, light emitting diode with the same and manufacturing method
TW201318120A
High conduction chip circuit device and the manufacturing method thereof
CN102751419A
Co-firing ceramic base plate with built-in heat radiating parts and light emitting diode with base plate
TW201242120A
Cofired ceramic substrate containing built-in heat-sink part and LED containing same
TW201218563A
comprises a substrate, electrode pairs, a covering part, and insulation stuff, in which the electrode pairs are formed on the paired substrate and connected to a power input and a power output respectively
CN102457055A
Over-voltage protection element with multiple air-gap electrode pairs
TW201142891A
Chip fuse and method for batchwise production of the chip fuse
TW201135980A
Light-emitting diode with substrate having surrounding wall and manufacturing method thereof
TW201128822A
Heat dissipating substrate with built-in surge protection unit and light emitting diode module
TW201126764A
Method for manufacturing light-emitting diode with substrate having fine perforations and light-emitting diode
CN102035175A
Over-temperature and over-current double protection element and manufacturing method thereof
TW201112298A
Over-temperature and over-current dual protection device and method of manufacturing the same
