SIIX CORP has a total of 13 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Japan, EPO (European Patent Office) and China. Its main competitors in its focus markets semiconductors, audio-visual technology and machine tools are KULICKE & SOFFA HOLDINGS INC, SIMM TECH CO LTD and TEL YAMANASHI KK.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 9 | |
#2 | EPO (European Patent Office) | 2 | |
#3 | China | 1 | |
#4 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Machine tools | |
#4 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Casings and printed circuits | |
#3 | Soldering, welding and flame cutting | |
#4 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Matsushima Yoshihiko | 9 |
#2 | Aitani Makoto | 3 |
#3 | Ezaki Ryota | 2 |
#4 | Imai Toru | 2 |
#5 | Inoue Masafumi | 2 |
#6 | Kunugi Isao | 2 |
#7 | Kawakami Tadashi | 2 |
#8 | Montian Touencharoon | 2 |
#9 | Yoshihiko Matsushima | 1 |
#10 | Murai Shiro | 1 |
Publication | Filing date | Title |
---|---|---|
JP2020191447A | Electronic component packaging method and electronic component packaging system | |
JP2012023283A | Heat dissipation substrate and method for manufacturing the same | |
JP2011192905A | Electronic apparatus case | |
JP2011091227A | Method of mounting electronic component on circuit board | |
JP2010245467A | Method of mounting transparent component | |
EP2244541A1 | Method for mounting surface mount electronc devices | |
JP2009117409A | Circuit board | |
JP2009064939A | Surface-mounting circuit board, method for manufacturing the surface-mounting circuit board, and method for mounting surface-mounted electronic devices | |
JP2008205356A | Circuit board and method for mounting electronic component onto circuit board | |
JP2005129307A | Surface heating plate and surface heating device using this |