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AT&S CHINA CO LTD

Overview
  • Total Patents
    40
  • GoodIP Patent Rank
    38,150
  • Filing trend
    ⇩ 62.0%
About

AT&S CHINA CO LTD has a total of 40 patent applications. It decreased the IP activity by 62.0%. Its first patent ever was published in 2015. It filed its patents most often in United States, EPO (European Patent Office) and Germany. Its main competitors in its focus markets audio-visual technology, semiconductors and basic materials chemistry are AN BOK MAN, HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD and DAEDUCK ELECTRONICS CO LTD.

Patent filings in countries

World map showing AT&S CHINA CO LTDs patent filings in countries

Patent filings per year

Chart showing AT&S CHINA CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tuominen Mikael 25
#2 Tay Annie 10
#3 Tay Seok Kim 10
#4 Xin Nick 6
#5 Baftiri Artan 6
#6 Dai Philips 4
#7 Sun Sally 4
#8 Bauer-Oeppinger Nikolaus 4
#9 Bauer-Öppinger Nikolaus 3
#10 Tamm Wilhelm 3

Latest patents

Publication Filing date Title
US2021127496A1 Component Carrier With Electrically Conductive Layer Structures Having Windows Defined By a Conformal Mask and Tapering at Least Partially
EP3813497A1 Component carrier with embedded component and horizontally elongated via
DE102020120314A1 Semiflex component carrier with a dielectric material that surrounds an embedded component and has a locally reduced modulus of elasticity
US2020305279A1 Semi-finished product for the production of connection systems for electronic components
US2020243436A1 Component Carrier
US10653009B1 Component Carrier With Improved Toughness Factor
US2020154558A1 Component Carrier With Improved Bending Performance
US2020137892A1 Component Carrier Having a Laser Via and Method of Manufacturing
WO2020087898A1 Semi-flexible component carrier with stepped layer structure
US2018288879A1 Component carrier and manufacturing method
EP3349552A1 Embedding component in component carrier by rigid temporary carrier
EP3437443A1 Component embedding in thinner core using dielectric sheet
US2017223819A1 Component carrier comprising a copper filled mechanical drilled multiple-diameter bore
US2017196081A1 Component carrier with different surface finishes
EP3384529A1 Electronic device with a plurality of component carrier packages being electrically and mechanically connected
US2018343751A1 Component carrier with alternatingly vertically stacked layer structures of different electric density