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UNIFLEX TECH INC

Overview
  • Total Patents
    64
  • GoodIP Patent Rank
    22,821
  • Filing trend
    ⇧ 108.0%
About

UNIFLEX TECH INC has a total of 64 patent applications. It increased the IP activity by 108.0%. Its first patent ever was published in 2015. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets audio-visual technology, semiconductors and optics are TEL YAMANASHI KK, SHINDO DENSHI KOUGIYOU KK and HONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD.

Patent filings in countries

World map showing UNIFLEX TECH INCs patent filings in countries
# Country Total Patents
#1 Taiwan 26
#2 China 20
#3 United States 10
#4 Japan 5
#5 Republic of Korea 3

Patent filings per year

Chart showing UNIFLEX TECH INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Yuan-Chih 49
#2 Liu Yi-Chun 32
#3 Li Chia-Ming 18
#4 Hung Pei-Hao 16
#5 Chen Ying-Hsing 14
#6 Chia Meng-Huan 13
#7 Huang Chiu-Pei 11
#8 Tu Cheng-I 9
#9 Li Yuanzhi 8
#10 Tseng Shan-Yi 8

Latest patents

Publication Filing date Title
CN112291926A Single-sided circuit board of light-emitting diode backlight module
TWI698686B Light-emitting diode backlight module single-sided circuit board
TWI704854B Circuit board structure and manufacturing method thereof, display device having circuit board structure and manufacturing method thereof
TW202034747A Substrate structure and manufacturing method thereof
CN111629513A Multi-layer circuit board structure with through hole and blind hole and its making method
TWI700021B Fabrication Method of Multilayer Circuit Board Structure with Through Holes And Blind Holes at The Same Time
TWI684835B Substrate structure with high reflectivity and manufacturing method thereof
CN111526662A Spliced light-emitting diode circuit board
CN111524921A Complementary metal oxide semiconductor photosensitive assembly, protective glass module and manufacturing method
TWI685098B Spliced led circuit board
TWI676283B Cmos phtosensitive unit, protection glass module thereof and manufaturing method of the same
CN111354845A Light-emitting diode carrier plate with preset conductive bumps
TW202025441A Led carrier board having preset bumps
CN111326640A Method for forming window on light-emitting diode carrier plate
TWI673784B Method for forming openings on an led carrier board
CN111180346A Method for manufacturing photoelectric mechanism with retaining wall
TWI668877B Production method for a photoelectric mechanism having a blocking wall
TWI682695B Circuit board structure with conection terminal formed by solder mask defined process
TW202007234A Circuit board structure having gap filling layer
TW202002333A Backlight circuit board structure with high reflectivity and method for making thereof