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IMBERA ELECTRONICS OY

Overview
  • Total Patents
    117
About

IMBERA ELECTRONICS OY has a total of 117 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Finland, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, audio-visual technology and machines are TUOMINEN RISTO, NEC TOPPAN CIRCUIT SOLUTIONS T and INAGAKI YASUSHI.

Patent filings per year

Chart showing IMBERA ELECTRONICS OYs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tuominen Risto 80
#2 Palm Petteri 56
#3 Iihola Antti 43
#4 Risto Tuominen 17
#5 Antti Iihola 10
#6 Petteri Palm 10
#7 Jokela Timo 7
#8 Waris Tuomas 5
#9 Kujala Arni 4
#10 Kivikero Antti 2

Latest patents

Publication Filing date Title
CN102348324A Electronic module with feed through conductor between wiring patterns
GB0922218D0 Rigid-flex circuit board, with embedded component, comprising a flexible region formed by removing sacrificial material
FI20095557A0 Manufacturing method and electronics module that offers new opportunities for conductors
CN102027585A Circuit module and method of manufacturing the same
CN102007825A Wiring board and method for manufacturing the same
FI20095110A0 Electronic module with EMI protection
GB0724097D0 Method for manufacturing a circuit board structure, and a circuit board structure
CN101199244A Method for manufacturing a circuit board structure, and a circuit board structure
EP1891845A2 Method for manufacturing a circuit board structure
KR20080019282A Method for manufacturing a circuit board structure, and a circuit board structure
FI20060256A Manufacturing of PCB and Component PCB
CN101065843A Method for manufacturing an electronics module
WO2006013230A2 Manufacture of a layer including a component
CN101010994A Method for manufacturing an electronics module
FI20041680A0 Electronics module and method for its manufacture
FI20041525A0 Electronics module and manufacturing process
KR20060066115A Method for manufacturing an electronic module
FI20040592A0 Conducting heat from an inserted component
CA2520992A1 Method for manufacturing an electronic module and an electronic module
FI20031201A0 Procedure for manufacturing an electronics module and an electronics module