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GENDAI DENSHI SANGYO KK

Overview
  • Total Patents
    386
About

GENDAI DENSHI SANGYO KK has a total of 386 patent applications. Its first patent ever was published in 1989. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, computer technology and machines are HYNIX SEMICONDUCTOR INC, HYUNDAI ELECTRONICS IND and POWERCHIP TECHNOLOGY CORP.

Patent filings in countries

World map showing GENDAI DENSHI SANGYO KKs patent filings in countries
# Country Total Patents
#1 Japan 386

Patent filings per year

Chart showing GENDAI DENSHI SANGYO KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kin Saikou 21
#2 Bee Souman 8
#3 Tei Jinjiyutsu 7
#4 Boku Eishin 6
#5 Kou Shiyun 6
#6 Jiyo Teigen 6
#7 Ri Shinkaku 6
#8 Go Shiyoukun 6
#9 U Soukou 6
#10 Chiyou Keishiyu 5

Latest patents

Publication Filing date Title
JPH09199495A Sog film forming method of semiconductor device
JPH09186995A Data compression method
JPH09168152A Apparatus and method for estimating movement in moving imageprocessing
JPH08280030A Apparatus and method for compressing shape information inrimage equipment for each object and polygonal approximation method
JPH0846201A Semiconductor element and its preparation
JPH07326717A Semiconductor memory device and preparation
JPH07326716A Di- ram capacitor preparation
JPH07274155A Text/graphic processing video tex interface device
JPH07211640A Sputtering system for manufacture of semiconductor element
JPH07321205A Metal wiring formation of semiconductor element
JPH0862605A Liquid crystal display device and preparation thereof
JPH0730937A Private automatic compound exchanger for isdn
JPH0722963A Adaptive variable-length encoder
JPH077725A Method of parallel processing and use of memory for movement compensation in high image quality television
JPH06209087A Manufacture of semiconductor device
JPH08320631A Fixation device of printing paper for office automation apparatus
JPH04268662A Tolerance system provided with multiple upu and control method for this system
JPH04332114A Mask-pattern forming method for semiconductor device
JPH03178155A Ic package
JPH03232271A Semiconductor device equipped with cylindrical laminated capacitor and its manufacture