| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 3 | |
| #2 | WIPO (World Intellectual Property Organization) | 2 | |
| #3 | Canada | 1 | |
| #4 | China | 1 | |
| #5 | Germany | 1 | |
| #6 | India | 1 | |
| #7 | Republic of Korea | 1 | |
| #8 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Machines | |
| #4 | Computer technology | |
| #5 | Machine tools | |
| #6 | Telecommunications |
| # | Name | Total Patents |
|---|---|---|
| #1 | Nieland Carsten | 9 |
| #2 | Kriebel Frank | 9 |
| #3 | Wagner Marco | 2 |
| #4 | Prescher Henry | 2 |
| #5 | Singleton Laurence | 2 |
| #6 | Kuellig Hannes | 1 |
| #7 | Schaefer Michael | 1 |
| #8 | Semar Robert | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2014084460A1 | Contact bumps methods of making contact bumps | |
| CN104737286A | Contact bump connection and contact bump and method for producing a contact bump connection | |
| DE102013207480A1 | Method of separating a wafer into chips |