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INDIUM CORP AMERICA

Overview
  • Total Patents
    75
  • GoodIP Patent Rank
    227,065
About

INDIUM CORP AMERICA has a total of 75 patent applications. Its first patent ever was published in 1940. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets machine tools, materials and metallurgy and audio-visual technology are SUH DAEWOONG, GRUBER PETER A and VESI SWITZERLAND AG.

Patent filings per year

Chart showing INDIUM CORP AMERICAs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Ning-Cheng 24
#2 Huang Benlih 12
#3 Murray William S 10
#4 Slattery James A 9
#5 Hwang Hong-Sik 8
#6 White Charles E T 7
#7 Dyer Jr John Robert 5
#8 Yin Wusheng 5
#9 Sovinsky John R 4
#10 Socha Paul A 4

Latest patents

Publication Filing date Title
CN101437971A Alloy compositions and techniques for reducing intermetallic compound thickness and oxidation of metals and alloys
CN101326295A Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US2007091574A1 Technique for forming a thermally conductive interface with patterned metal foil
US2007092396A1 Technique for increasing the compliance of lead-free solders containing silver
CN101351297A Low melting temperature compliant solders
CN101341266A Technique for increasing the compliance of tin-indium solders
US2007071634A1 Low melting temperature compliant solders
US2007048172A1 Technique for increasing the compliance of tin-indium solders
CN101072886A Anti-tombstoning lead free alloys for surface mount reflow soldering
US7017795B2 Solder pastes for providing high elasticity, low rigidity solder joints
US2005028361A1 Integrated underfill process for bumped chip assembly
US6677179B2 Method of applying no-flow underfill
US6610559B2 Integrated void-free process for assembling a solder bumped chip
US2002063147A1 Anti-tombstoning solder alloys for surface mount applications
US6059900A Lead-based solders for high temperature applications
US5957364A Integrated solder preform array having a tin outer coating
US5600102A Solder preform wrappable around a printed circuit card edge
WO9520460A1 Solder paste utilizing aromatic carboxylic acids
US5455004A Lead-free alloy containing tin, zinc, indium and bismuth
US5242658A Lead-free alloy containing tin, zinc and indium