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DE102019111580A1
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Method for calibrating a device for mounting components
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DE102018128616A1
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Device and method for detaching a chip from an adhesive film
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US2019157122A1
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Bonding head for mounting components and die bonder with such a bonding head
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Chip ejector.
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Bonding head for the assembly of components and die bonders with such a bonding head.
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DE102018115144A1
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Actuator for a bondhead
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JP2018190958A
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Apparatus and method for mounting component on substrate
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Method and device for the assembly of semiconductor chips.
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SG10201606167WA
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Method for mounting semiconductors provided with bumps on substrate locations of a substrate
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Method for mounting bumped semiconductor chips on substrate sites of a substrate
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Device for mounting components on a substrate.
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Continuous furnace and die bonder with a continuous furnace.
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CH708287A2
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Electromagnetic two-axis linear motor.
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CH708932A1
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Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
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Continuous furnace for substrates, which are equipped with components, and Die Bonder.
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Device for applying and spreading of solder to a substrate.
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Kinematic holding system for a placement head of a placement apparatus
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Method for mounting electronic or optical components on a substrate.
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CH707890A1
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Device for applying adhesive to a substrate.
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Digital resonant driver for an electric resonator.
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