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SAMSUNG SEMICONDUCTOR CN R&D

Overview
  • Total Patents
    120
  • GoodIP Patent Rank
    46,094
  • Filing trend
    ⇩ 100.0%
About

SAMSUNG SEMICONDUCTOR CN R&D has a total of 120 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2009. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and computer technology are PHOENIX PREC TECHNOLOGY, CHANDRASEKARAN ARVIND and OHKUCHI MATERIALS CO LTD.

Patent filings in countries

World map showing SAMSUNG SEMICONDUCTOR CN R&Ds patent filings in countries
# Country Total Patents
#1 China 120

Patent filings per year

Chart showing SAMSUNG SEMICONDUCTOR CN R&Ds patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Du Maohua 11
#2 Ma Huishu 5
#3 Liqun Gu 5
#4 Liu Hai 5
#5 Yang Xiangrong 4
#6 Wang Jincheng 4
#7 Maohua Du 4
#8 Wang Ying 3
#9 Xie Xiaoqiang 3
#10 Wang Yuchuan 3

Latest patents

Publication Filing date Title
CN106876364A Semiconductor package assembly and a manufacturing method thereof
CN106792952A The method and apparatus of Wireless Fidelity access point are connected to for terminal
CN106298709A Low cost fan-out formula encapsulating structure
CN105960105A Vacuum separator plate and lead frame magazine with vacuum separator plate
CN105704929A Printed circuit board, integrated circuit packaging part and method for producing printed circuit board
CN105633047A Semiconductor package and manufacturing method thereof
CN105702635A Semiconductor package
CN105742283A Inverted stacked package
CN105185756A Semiconductor packaging part and method for manufacturing same
CN105140203A Solder ball and manufacturing method therefor, and ball grid array package comprising solder ball
CN105118820A Package and manufacturing method thereof, and package stacking structure and manufacturing method thereof
CN105072826A Printed circuit board, manufacturing method thereof, and method for manufacturing semiconductor packaging piece
CN104810332A Fan-out wafer level package part and manufacture method thereof
CN104576554A Packaging part and manufacturing method thereof
CN104535874A Device and method for testing aging of multi-key input function of electronic device
CN104465583A Ball grid array packaging piece and method for installing ball grid array packaging piece on substrate
CN104462008A Physical-memory-shared multi-processor communication system and communication method thereof
CN104409447A Embedded capacitor-containing semiconductor package and manufacturing method thereof
CN104409448A Semiconductor package and manufacture method thereof
CN104441940A Silk-screen printing device and silk-screen printing method