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DUK SAN TEKOPIA CO LTD

Overview
  • Total Patents
    19
  • GoodIP Patent Rank
    218,535
About

DUK SAN TEKOPIA CO LTD has a total of 19 patent applications. Its first patent ever was published in 2005. It filed its patents most often in Republic of Korea and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, basic materials chemistry and macromolecular chemistry and polymers are HOJEONABLE, NAMICS CORP and ORMET CIRCUITS INC.

Patent filings in countries

World map showing DUK SAN TEKOPIA CO LTDs patent filings in countries

Patent filings per year

Chart showing DUK SAN TEKOPIA CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Sung Chul 11
#2 Jang Yong Un 10
#3 Jang Seung Jun 10
#4 Son Yoon Sang 10
#5 Chu Yong Cheol 6
#6 Jeong Soon Ho 5
#7 Bae Sang Jun 4
#8 Park Ho In 4
#9 Kim Tae Min 3
#10 Yang Yeong Gyeong 3

Latest patents

Publication Filing date Title
KR20180061572A Negative photosensitive resin composition, film and electronic device
KR20170123050A Stripping compositions for photoresist
KR20140000501A Purification device of tmga
KR20130042241A Epoxy soldering flux having heat radiation function and mounting method of semiconductor device
KR20120119426A Flux for solder paste, solder paste, and solder bump, and manufacturing method thereof
KR20120115444A Vehicle compositon and conductive composition using the same
KR20120067093A Epoxy soldering flux having heat radiation function and mounting method of semiconductor device
KR20110095021A Conductive ink and device using the same
KR20110094714A Solder ink and device package using the same
KR20110049466A Conductive paste and the manufacturing method thereof and the electric device comprising thereof
KR20100093452A Conductive paste and the manufacturing method thereof and the electric device comprising thereof
KR100929136B1 Conductive paste and the manufacturing method thereof and the electric device comprising thereof
KR20100067702A Fabricating method for solder ball having adhesion coating layer and the same
KR20090084559A Method and apparatus for manufacturing ultrafine lead-free solder powder for lead-free solder paste
KR20090083129A Solder ball for semiconductor device package
KR20060127481A Method and apparatus for manufacturing metal powder of lead-free solder cream and the metal powder