Learn more

NAMICS CORP

Overview
  • Total Patents
    955
  • GoodIP Patent Rank
    2,681
  • Filing trend
    ⇧ 12.0%
About

NAMICS CORP has a total of 955 patent applications. It increased the IP activity by 12.0%. Its first patent ever was published in 1996. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets macromolecular chemistry and polymers, semiconductors and basic materials chemistry are SHOWA DENKO ELECTRICIAN MAT CO LTD, CLUSTER TECH CO LTD and ANSHENG TECH GUANGDONG CO LTD.

Patent filings per year

Chart showing NAMICS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Teraki Shin 103
#2 Iwaya Kazuki 83
#3 Arai Fuminori 66
#4 Yoshida Masaki 57
#5 Fujita Takayuki 53
#6 Takahashi Tomoyuki 50
#7 Sakai Noriyuki 49
#8 Suzuki Osamu 47
#9 Sato Hiroshi 39
#10 Kurokawa Tsuyoshi 34

Latest patents

Publication Filing date Title
WO2021079952A1 Composite copper member
WO2021075265A1 Paste for electromagnetic shielding
WO2021075206A1 Polymerizable composition and curable resin composition using same
WO2021075197A1 Resin composition
WO2020226160A1 Composite copper member
WO2020202819A1 Porous carbon material and resin composition
WO2020202782A1 Resin composition-filled syringe, and production method and preservation method for same
TW202035597A Photocurable resin composition and cured material obtained by curing the same
WO2020116408A1 Resin composition for millimeter-wave substrate, adhesive film for millimeter-wave substrate, millimeter-wave substrate, millimeter-wave radar substrate, and semiconductor device
WO2020090757A1 Conductive resin composition, conductive adhesive, and semiconductor device
WO2020080389A1 Resin composition
WO2020080391A1 Resin composition
WO2020080390A1 Resin composition
WO2020075707A1 Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound
WO2020071526A1 Resin composition
WO2020066968A1 Conductive paste
WO2020071153A1 Resin composition, substrate-attached film, metal/resin laminated body and semiconductor device
JP2020186464A Composite copper member
WO2021033325A1 Epoxy resin composition
WO2021033329A1 Epoxy resin composition