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HESSE GMBH

Overview
  • Total Patents
    66
  • GoodIP Patent Rank
    35,337
  • Filing trend
    ⇧ 80.0%
About

HESSE GMBH has a total of 66 patent applications. It increased the IP activity by 80.0%. Its first patent ever was published in 1992. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets machine tools, semiconductors and computer technology are PINK GMBH THERMOSYSTEME, LASERSSEL CO LTD and KOREA SEMICINDUCTOR SYSTEM CO LTD.

Patent filings per year

Chart showing HESSE GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Brökelmann Michael 34
#2 Hesse Hans-Jürgen 32
#3 Hunstig Matthias 29
#4 Unger Andreas 12
#5 Walther Frank 7
#6 Hesse Hans-Juergen 6
#7 Jochheim Andreas 5
#8 Broekelmann Michael 4
#9 Belting Gregor 4
#10 Riese Markus 4

Latest patents

Publication Filing date Title
WO2021047737A1 Ultrasonic tool and ultrasonic connection device therefor
DE102019124334A1 Bond arrangement and bonding tool
DE102019124335A1 Bonding device
DE102019124332A1 Device and method for detecting a temperature of a bonding tool during laser-assisted ultrasonic bonding
DE102019124333A1 Method for producing an electrically conductive connection
DE102018121696A1 Method for electrically contacting a battery pack
DE102018120822A1 Bonding arrangement and bonding tool
EP3577686A1 Method for fixing a workpiece to be bonded in a working area of a bonder
DE102017129546A1 Bonding tool and bonding device
DE102017127251A1 Bonding tool and manufacturing method for a bonding tool
DE102017123122A1 Method for bonding large modules and bonding arrangement
DE102016110590A1 Automatic bond force calibration
DE102016105494A1 BOND TOOL TIP, BOND TOOL, METHOD FOR PRODUCING A BOND TOOL TIP AND METHOD FOR PRODUCING A BOND COMPOUND
DE102015120824A1 Operating method for an ultrasonic wire bonder
WO2015176715A1 Method for the vibration-assisted, metallic joining of components face to face
DE102014109630A1 Apparatus for making a bond and transducer therefor
DE102012112413A1 Tool for producing a friction-welded connection
DE102010024623A1 Precision machine tool
DE102006049624A1 ultrasonic Bonder
MY150947A Method of and apparatus for testing a wire bond connection