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DAIWA KASEI KENKYUSHO

Overview
  • Total Patents
    77
About

DAIWA KASEI KENKYUSHO has a total of 77 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Japan and United States. Its main competitors in its focus markets surface technology and coating, audio-visual technology and environmental technology are NIPPON DENKAI LTD, FURUKAWA CIRCUIT FOIL KK and FURUKAWA CIRCUIT FOIL FOIL CO.

Patent filings in countries

World map showing DAIWA KASEI KENKYUSHOs patent filings in countries
# Country Total Patents
#1 Japan 76
#2 United States 1

Patent filings per year

Chart showing DAIWA KASEI KENKYUSHOs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Obata Keigo 40
#2 Takeuchi Takao 36
#3 Masaki Seiji 36
#4 Nawafune Hidemi 22
#5 Okuhama Yoshiaki 20
#6 Yoshimoto Masakazu 14
#7 Nishimura Hideo 13
#8 Aoki Kazuhiro 12
#9 Tsuji Seiki 10
#10 Kondo Tetsuya 10

Latest patents

Publication Filing date Title
JP2003157833A Negative electrode for lithium secondary battery and its manufacturing method
JP2003144094A Nutritive supplement food or drink composition
JP2003142088A Electrode material for secondary battery by plating method and its manufacturing method
JP2003129278A Process for inhibiting tin whisker through pre-treatment
JP2003105589A Tin plating bath for preventing whisker and method of plating tin
JP2003096590A Tin or tin-alloy plating bath, stannate and stannic acid or complexing-agent solutions for preparation or maintenance/supply of the plating bath, and electrical/ electronic parts produced by using the plating bath
JP2003096579A Composition for discoloration and corrosion prevention of silver, silver plating, silver ally, or silver alloy plating
JP2003027277A Tinning bath, tinning method and electronic parts subjected to tinning using plating bath used therefor
JP2002226498A Dna molten salt
JP2002206180A Reflecting mirror
JP2002069656A Dissolving solution for palladium or palladium compound
JP2001262391A Tin-copper based alloy plating bath and electronic parts having coating film formed with the same
JP2000355774A Plating method and plating solution precursory used therefor
JP2001172791A Tin-copper base alloy plating bath and electronic part with tin-copper base alloy film formed by the plating bath
JP2000128529A Solution to dissolve silver halide
JP2000080493A Tin or tin alloy plating bath
JP2000073191A Solution for removing oxide film
JP2000034593A Aqueous solution for reduction precipitation of metal
JP2000026977A Aqueous solution for obtaining noble metal by chemical reduction deposition
JP2000026991A Tin and tin alloy plating bath