| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | Republic of Korea | 5 | |
| #3 | EPO (European Patent Office) | 3 | |
| #4 | Canada | 1 | |
| #5 | France | 1 | |
| #6 | Taiwan | 1 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yoshimoto Masakazu | 13 |
| #2 | Obata Keigo | 12 |
| #3 | Okuhama Yoshiaki | 9 |
| #4 | Takeuchi Takao | 8 |
| #5 | Tsuji Kiyotaka | 8 |
| #6 | Nawafune Hidemi | 5 |
| #7 | Kitamura Shingo | 5 |
| #8 | Nakao Seiichiro | 4 |
| #9 | Uchida Ei | 4 |
| #10 | Masaki Seishi | 4 |
| Publication | Filing date | Title |
|---|---|---|
| US2015184307A1 | Silver electroplating solution | |
| KR20050026773A | Shielding materials for electromagnetic interference | |
| US2004043153A1 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method | |
| US5618404A | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use |