| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Taiwan | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 2 | |
| #5 | Republic of Korea | 1 | |
| #6 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Audio-visual technology | |
| #3 | Machines | |
| #4 | Electrical machinery and energy | |
| #5 | Environmental technology | |
| #6 | Medical technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hoshino Kazuhiro | 7 |
| #2 | Suzuki Akitoshi | 7 |
| #3 | Nakaoka Tadao | 7 |
| #4 | Fukuda Shin | 4 |
| #5 | Kato Hitoshi | 3 |
| #6 | Oguro Ryoichi | 3 |
| #7 | Ashizawa Koichi | 3 |
| #8 | Inoue Kazuyuki | 3 |
| #9 | Akutsu Tsukasa | 3 |
| #10 | Wolski Adam M | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2004038049A1 | Copper foil for high-density ultrafine printed wiring boad | |
| WO9809003A1 | Process for preparing porous electrolytic metal foil |