| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 11 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Furniture and games | |
| #5 | Electrical machinery and energy | |
| #6 | Semiconductors | |
| #7 | Environmental technology | |
| #8 | Thermal processes |
| # | Name | Total Patents |
|---|---|---|
| #1 | Matsuda Akira | 4 |
| #2 | Suzuki Yuuji | 4 |
| #3 | Kimijima Hisao | 3 |
| #4 | Otsuka Hideo | 3 |
| #5 | Suzuki Akitoshi | 3 |
| #6 | Shinozaki Kensaku | 3 |
| #7 | Yoshihara Yasuhisa | 2 |
| #8 | Fukuda Shin | 1 |
| #9 | Moteki Takami | 1 |
| #10 | Hoshino Kazuhiro | 1 |
| Publication | Filing date | Title |
|---|---|---|
| KR20040077511A | Copper foil for shielding electromagnetic wave, manufacturing method thereof and electromagnetic wave shield structure | |
| KR20040038761A | Thin cooper foil adhered to carrier and method for manufacturing the same, and printed circuit board using the same |