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FURUKAWA CIRCUIT FOIL KK

Overview
  • Total Patents
    71
About

FURUKAWA CIRCUIT FOIL KK has a total of 71 patent applications. Its first patent ever was published in 1991. It filed its patents most often in Japan and Taiwan. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machines are FURUKAWA CIRCUIT FOIL, CIRCUIT FOIL LUXEMBOURG TRADING SARL and FURUKAWA CIRCUIT FOIL FOIL CO.

Patent filings in countries

World map showing FURUKAWA CIRCUIT FOIL KKs patent filings in countries
# Country Total Patents
#1 Japan 70
#2 Taiwan 1

Patent filings per year

Chart showing FURUKAWA CIRCUIT FOIL KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Suzuki Yuji 30
#2 Suzuki Akitoshi 30
#3 Hoshino Kazuhiro 14
#4 Fukuda Shin 13
#5 Matsuda Akira 12
#6 Matsumoto Sadao 10
#7 Kikuchi Yuuki 8
#8 Otsuka Hideo 7
#9 Mogi Takasane 7
#10 Nakaoka Tadao 7

Latest patents

Publication Filing date Title
JP2008199051A Copper foil for electromagnetic-wave shielding, and manufacturing method therefor
JP2009068042A Copper foil having excellent ultrasonic weldability, and surface treatment method therefor
JP2008285727A Electrolytic copper foil with high tensile-strength, and manufacturing method therefor
JP2008013847A Surface treated electrodeposited copper foil, the production method and circuit board
JP2007186797A Method for producing ultrathin copper foil with carrier, ultrathin copper foil produced by the production method, and printed circuit board, multilayer printed circuit board and wiring board for chip on film using the ultrathin copper foil
JP2008184633A Method for surface-treating metal foil
JP2008156727A Surface-treated copper foil
JP2008127618A Method for treating surface of copper foil through feeding alternating current
JP2007186781A Ultrathin copper foil with carrier and printed circuit board
JP2007186782A Ultrathin copper foil with carrier and printed circuit board using the same
JP2008007803A Surface-treated copper foil
JP2007314855A Ultra-thin copper foil provided with carrier, copper-clad laminate and printed circuit board
JP2007266431A Conductive base material with thin resistance layer, method for manufacturing conductive base material with thin resistance layer, and circuit board with thin resistance layer
JP2006207032A Ultrathin copper foil with carrier and method for manufacturing the same, and printed wiring board using ultrathin copper foil with carrier
JP2006261650A Flexible printed wiring board copper foil, method of manufacturing the foil, and flexible printed wiring board
JP2007146258A Electrolytic copper foil, printed wiring board and multilayer printed wiring board
JP2007042695A Laminated circuit board
JP2007042696A Laminated circuit board
JP2007021921A Ultrathin copper foil with carrier and printed wiring board
JP2007007937A Very thin copper foil with carrier, flexible copper-clad polyimide laminate, and flexible printed wiring polyimide board