CIRCUIT FOIL SA has a total of 22 patent applications. Its first patent ever was published in 1993. It filed its patents most often in WIPO (World Intellectual Property Organization), Canada and Brazil. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machines are YATES FOIL USA INC, NIKKO GOULD FOIL KK and CIRCUIT FOIL USA INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 4 | |
#2 | Canada | 3 | |
#3 | Brazil | 2 | |
#4 | China | 2 | |
#5 | Poland | 2 | |
#6 | Russian Federation | 2 | |
#7 | Australia | 1 | |
#8 | Czechia | 1 | |
#9 | EPO (European Patent Office) | 1 | |
#10 | Finland | 1 | |
#11 | United Kingdom | 1 | |
#12 | Slovakia | 1 | |
#13 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Surface technology and coating | |
#3 | Machines | |
#4 | Measurement | |
#5 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Wolski Adam M | 13 |
#2 | Streel Michel | 12 |
#3 | Suzuki Akitoshi | 7 |
#4 | Otsuka Hideo | 7 |
#5 | Collard Michel | 6 |
#6 | Mathieu Michel | 6 |
#7 | Acx Kurt | 6 |
#8 | Dufresne Paul | 6 |
#9 | Schnettler Roland | 5 |
#10 | May Hans Josef | 5 |
Publication | Filing date | Title |
---|---|---|
RU2166567C2 | Process of manufacture of electrically precipitated copper foil and copper foil produced by this process | |
CN1198293A | Copper foil for manufacture of printed circuits and method of producing same | |
GB9320037D0 | Visual inspection system |