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CHIPMORE TECH CORPORATION LIMITED

Overview
  • Total Patents
    29
  • GoodIP Patent Rank
    55,010
  • Filing trend
    ⇧ 400.0%
About

CHIPMORE TECH CORPORATION LIMITED has a total of 29 patent applications. It increased the IP activity by 400.0%. Its first patent ever was published in 2017. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machine tools and chemical engineering are SHANGHAI KAIHONG ELECTRONIC CO LTD, SEMILEDS CORP and TANAKA ELECTRONICS IND.

Patent filings in countries

World map showing CHIPMORE TECH CORPORATION LIMITEDs patent filings in countries

Patent filings per year

Chart showing CHIPMORE TECH CORPORATION LIMITEDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Xu Guanmeng 6
#2 Mei Yan 6
#3 Chen Hao 5
#4 Jin Chaochao 3
#5 You Shengtian 2
#6 Zhao Yonghui 1
#7 Wu Jiajia 1
#8 Chen Xiulong 1
#9 Huang Lei 1
#10 Huang Xin 1

Latest patents

Publication Filing date Title
CN112017978A Method for forming chip metal lug
CN111734223A Crystal boat unlocking tool
CN111739833A Chip crimping joint vacuum hole through hole device
CN111739813A Chip packaging method and chip packaging structure
CN111725083A Method for forming chip metal lug
CN111498580A Chip winding tape feeding device
CN111508910A Flip chip packaging structure and packaging method
CN111341746A Ball-planting structure and preparation process
CN111128755A Packaging structure and forming method thereof
CN111146170A Packaging structure and forming method thereof
CN111120608A Half nut assembly
CN111128846A Ejector pin device for chip packaging
CN111128817A Cover opening device and method for wafer carrier
CN110739238A COF packaging method
CN110539070A Laser processing method and laser processing apparatus
CN110544679A Chip rewiring structure and preparation method thereof
CN110323201A Flexible circuit board and flip chip encapsulating structure
CN109979834A Bump manufacturing method for semiconductor packages
CN111384017A Flip chip assembly, flip chip packaging structure and preparation method
CN111376400A Wafer cutting machine and use method thereof