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CHIP COOLERS INC

Overview
  • Total Patents
    35
About

CHIP COOLERS INC has a total of 35 patent applications. Its first patent ever was published in 1994. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are COOL SHIELD INC, FOXCONN PREC COMPONENTS CO LTD and FIERKENS RICHARD H J.

Patent filings per year

Chart showing CHIP COOLERS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mccullough Kevin A 20
#2 Rife William B 10
#3 Sagal E Mikhail 4
#4 Johnson Philip 3
#5 Tata Peter D 3
#6 Miller James D 3
#7 Pare Rodney H 2
#8 Mccullough Kevin Albert 2
#9 Kevin A Mccullough 1

Latest patents

Publication Filing date Title
WO0160138A1 Multi-device heat sink assembly
WO0141522A1 Structural frame of thermally conductive material
US6237223B1 Method of forming a phase change heat sink
US6252774B1 Multi-device heat sink assembly
US6214263B1 Method of molding a reinforced article
US6261495B1 Process of molding a polymer reinforced with particles
US6093961A Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment
US6201697B1 Heat sink assembly with cam lock
US6139783A Method of molding a thermally conductive article
US6075699A Heat sink assembly with snap-in legs
US6048919A Thermally conductive composite material
US6021045A Heat sink assembly with threaded collar and multiple pressure capability
US5945736A Heat sink assembly with snap-in cover plate having multiple pressure capability
US6014315A Heat sink assembly with multiple pressure capability
US5825622A Heat sink assembly with adjustable mounting clip
US5774335A Heat sink assembly with height adjustable mounting clip
US5784257A Heatsink assembly with adjustable retaining clip
US5667870A Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member
EP0687383A4 Heat sink assembly for solid state devices