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US4572757A
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Method of making a microcircuit substrate
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US4378902A
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Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices
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US4400714A
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Lead frame for semiconductor chip
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US4300715A
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Mechanical pulse reflow bonding process
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US4273204A
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Capacitive force load cell for weighing scale
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US4166562A
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Assembly system for microcomponent devices such as semiconductor devices
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US4025750A
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Compliant electrode
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US4015763A
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Alignment pawl for film-carrier advance mechanism
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US3949925A
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Outer lead bonder
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US4010885A
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Apparatus for accurately bonding leads to a semi-conductor die or the like
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US3750265A
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Method of preforming solder to a plurality of terminals
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US3756067A
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Temperature measurement
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US3688074A
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Electrode wear compensating apparatus for an electrical discharge machine
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US3685117A
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Alignment fixture
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US3559285A
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Method of forming leads for attachment to semi-conductor devices
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US3502893A
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Radiation sensitive means for determining the position of an object
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US3436810A
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Method of packaging integrated circuits
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US3423597A
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Radiation sensitive position sensing apparatus
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US3531198A
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Method of printing images on opposite sides of a substrate
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US3399593A
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Precision artwork duplicating machine
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