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MALICO INC

Overview
  • Total Patents
    23
About

MALICO INC has a total of 23 patent applications. Its first patent ever was published in 1996. It filed its patents most often in United States, Taiwan and Germany. Its main competitors in its focus markets semiconductors, machine tools and machines are AAVID ENG INC, ALPHASEM AG and ROKKO TECHNOLOGY PTE LTD.

Patent filings in countries

World map showing MALICO INCs patent filings in countries
# Country Total Patents
#1 United States 12
#2 Taiwan 7
#3 Germany 2
#4 United Kingdom 2

Patent filings per year

Chart showing MALICO INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liang Robert 20
#2 Wu Chia-Fu 2
#3 Liang Guo-En 1
#4 Jong Mingo 1

Latest patents

Publication Filing date Title
US2011216506A1 Heat sink buckle
US2010172105A1 Heatsink assembly
US2010172106A1 Heatsink assembly
GB0802525D0 Positioning and securing device for a heatsink
US2009195987A1 Positioning device for heatsink
GB0710044D0 Heat sink assembly
TW200807228A Heat sink assembly having relatively lower wind resistance
DE102006033228A1 Heat-dissipating device manufacture for memory, involves integrally forming protrusions on one side of metal plate and flat portion on the other side of the metal plate
US7307842B1 Heat sink assembly having retaining device with relatively better heat dissipation effectiveness
TW200744438A Heat dissipation device of memory and method of producing the same
US2007271787A1 Methods for manufacturing heat sink having relatively high aspects ratio thereof
TW200601951A Heat dissipation structure and its assembling method
US2004264130A1 Heat-dissipating device for flat display
TW200514493A Heat sink structure and manufacturing method thereof
TW200509776A Heat sink structure and the manufacturing method thereof
TWI220103B Fastener of heat sink table
TW200506463A Heat sink structure for backlight module
US2004088860A1 Environmental protection concerned method for manufacturing heat sink
US6476484B1 Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier
US2003011995A1 Anchor base for heat sink of IC chipset