BIECK FLORIAN has a total of 11 patent applications. Its first patent ever was published in 2002. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and machines are HUNETPLUS CO LTD, INVENSAS BONDING TECH INC and CHIEN CHIN-CHENG.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 8 | |
#2 | WIPO (World Intellectual Property Organization) | 3 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology | |
#3 | Machines | |
#4 | Measurement | |
#5 | Audio-visual technology | |
#6 | Optics | |
#7 | Materials and metallurgy | |
#8 | Surface technology and coating |
# | Name | Total Patents |
---|---|---|
#1 | Bieck Florian | 11 |
#2 | Sukmadevi Asfhandy Carolinda | 2 |
#3 | Montgomery Robert J | 2 |
#4 | Spiller Sven-Manfred | 2 |
#5 | Leib Jeurgen | 1 |
#6 | Leib Juergen | 1 |
#7 | Mund Dietrich | 1 |
#8 | Leib Jurgen | 1 |
#9 | Spiller Sven | 1 |
Publication | Filing date | Title |
---|---|---|
US9076779B1 | Packaging of electronic circuitry | |
US2012299610A1 | Method and apparatus for testing a semiconductor wafer | |
WO2009141740A2 | Semiconductor wafer and method for producing the same |