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ASM NUTOOL INC

Overview
  • Total Patents
    87
About

ASM NUTOOL INC has a total of 87 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, Taiwan and China. Its main competitors in its focus markets semiconductors, surface technology and coating and machine tools are NUTOOL INC, KEIGLER ARTHUR and ACM RES INC.

Patent filings per year

Chart showing ASM NUTOOL INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Basol Bulent M 55
#2 Talieh Homayoun 44
#3 Uzoh Cyprian E 16
#4 Young Douglas W 10
#5 Ashjaee Jalal 10
#6 Uzoh Cyprian 7
#7 Volodarsky Konstantin 7
#8 Basol Bulent 6
#9 Velazquez Efrain 4
#10 Bogart Jeffrey 4

Latest patents

Publication Filing date Title
US2009065365A1 Method and apparatus for copper electroplating
US2007293040A1 Filling deep features with conductors in semiconductor manufacturing
US2008242078A1 Process of filling deep vias for 3-d integration of substrates
US2007131563A1 Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US2007238293A1 Filling deep features with conductors in semiconductor manufacturing
TW200633038A Means to eliminate bubble entrapment during electrochemical processing of workpiece surface
JP2005260224A System for electrochemical mechanical polishing
JP2005187943A Method and apparatus to deposit layer with uniform property
WO2005045906A1 System and method for electroless surface conditioning
US7129165B2 Method and structure to improve reliability of copper interconnects
US7141146B2 Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US7064057B2 Method and apparatus for localized material removal by electrochemical polishing
TW200418101A Electroetching system and process
US7045040B2 Process and system for eliminating gas bubbles during electrochemical processing
US6939203B2 Fluid bearing slide assembly for workpiece polishing
US6866763B2 Method and system monitoring and controlling film thickness profile during plating and electroetching
US2004198190A1 Method for reduction of defects in wet processed layers
US7101471B2 Method for planar material removal technique using multi-phase process environment
US6943112B2 Defect-free thin and planar film processing
TW200307334A Integrated system for processing semiconductor wafers