| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 15 | |
| #2 | Australia | 1 | |
| #3 | EPO (European Patent Office) | 1 | |
| #4 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating | |
| #3 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Keigler Arthur | 18 |
| #2 | Fisher Freeman | 6 |
| #3 | Liu Zhenqiu | 5 |
| #4 | Goodman Daniel L | 5 |
| #5 | Wu Qunwei | 3 |
| #6 | Harrell John | 3 |
| #7 | Asdigha Mehran | 2 |
| #8 | Haynes Jonathan | 1 |
| #9 | Guarnaccia David G | 1 |
| #10 | Zhang Zhongqin | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2012308344A1 | Parallel single substrate processing system with alignment features on a process section frame | |
| US2012305404A1 | Method and apparatus for fluid processing a workpiece | |
| US2012152752A1 | Electroplated lead-free bump deposition | |
| US2011240481A1 | Seed layer deposition in microscale features | |
| US2010212694A1 | Wetting a workpiece surface in a fluid-processing system | |
| AU3319200A | Handling thin workpieces |