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ACM RES INC

Overview
  • Total Patents
    130
About

ACM RES INC has a total of 130 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets surface technology and coating, semiconductors and machine tools are KEIGLER ARTHUR, HOUJIYOU TETSUYA and BASKER VEERARAGHAVAN S.

Patent filings per year

Chart showing ACM RES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Hui 111
#2 Yih Peihaur 43
#3 Gutman Felix 35
#4 Nuch Voha 32
#5 Afnan Muhammed 30
#6 Koehler Damon L 18
#7 Chokshi Himanshu J 17
#8 Wang Jian 16
#9 Hui Wang 15
#10 Chang Ru Kao 14

Latest patents

Publication Filing date Title
WO2007130452A1 Removing barnier layer using an electron polishing process
US2007023912A1 Integrating metal with ultra low-k-dielectrics
TW200738916A Improving surface roughness during electro-polishing
WO2006110864A2 Method for improving surface roughness during electro-polishing
WO2005082057A2 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
US2007131561A1 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
TW200525622A Method and system of monitoring an electropolishing process of a metal layer, system to electropolishing a metal layer formed on a wafer and methods and systems to monitor the same
AU2003303155A1 Localized reflow for wire bonding and flip chip connections
AU2003297814A8 Measuring alignment between a wafer chuck and polishing/plating receptacle
AU2003256673A1 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
CA2479873A1 Electropolishing and electroplating methods
TW200402821A Electropolishing and/or electroplating apparatus and methods
WO03042433A1 Electropolishing assembly and methods for electropolishing conductive layers
CN1547763A Dummy structures to reduce metal recess in electropolishing process
AU2002336360A1 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
US6638863B2 Electropolishing metal layers on wafers having trenches or vias with dummy structures
AU9276201A Integrating metal with ultra low-k dielectrics
US2006221353A9 Method and apparatus for end-point detection
US6447668B1 Methods and apparatus for end-point detection
CN1632914A Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers