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SEMITOOL INC

Overview
  • Total Patents
    852
About

SEMITOOL INC has a total of 852 patent applications. Its first patent ever was published in 1987. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, surface technology and coating and machines are ACM RES SHANGHAI INC, KEIGLER ARTHUR and COHEN URI.

Patent filings per year

Chart showing SEMITOOL INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hanson Kyle M 140
#2 Thompson Raymon F 114
#3 Woodruff Daniel J 108
#4 Bergman Eric J 100
#5 Mchugh Paul R 95
#6 Wilson Gregory J 88
#7 Ritzdorf Thomas L 83
#8 Curtis Gary L 70
#9 Chen Linlin 59
#10 Berner Robert W 55

Latest patents

Publication Filing date Title
TW201214551A Systems and methods for etching silicon nitride
CN102725440A Photoresist removing processor and methods
TW200837838A Single wafer anneal processor
US2008083427A1 Post etch residue removal from substrates
US2009024244A1 High throughput semiconductor wafer processing
US2008264774A1 Method for electrochemically depositing metal onto a microelectronic workpiece
US2008232935A1 Apparatus for removing a semiconductor workpiece from within a fixture
CN101389415A Single side workpiece processing
TW200739787A Single side workpiece processing
US2008190757A1 Electro-chemical processor with wafer retainer
TW200737349A Methods for forming thin oxide layers on semiconductor wafers
US2008179180A1 Apparatus and methods for electrochemical processing of microfeature wafers
US2008163898A1 System for processing a workpiece
US2008003781A1 Electro-chemical processor
US2007151844A1 Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
US2008048306A1 Electro-chemical processor
US2008041727A1 Method and system for depositing alloy composition
US2010078334A1 Electro-chemical processor
US2008006617A1 Thermal wafer processor
US2007261964A1 Reactors, systems, and methods for electroplating microfeature workpieces