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ACM RES SHANGHAI INC

Overview
  • Total Patents
    432
  • GoodIP Patent Rank
    5,454
  • Filing trend
    ⇩ 18.0%
About

ACM RES SHANGHAI INC has a total of 432 patent applications. It decreased the IP activity by 18.0%. Its first patent ever was published in 2007. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets semiconductors, chemical engineering and surface technology and coating are ACM RES (SHANGHAI) INC, SEMITOOL INC and KEIGLER ARTHUR.

Patent filings per year

Chart showing ACM RES SHANGHAI INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Hui 398
#2 Wang Jian 272
#3 Jin Yinuo 127
#4 Wang Xi 118
#5 Chen Fuping 115
#6 Jia Zhaowei 113
#7 Zhang Xiaoyan 78
#8 Chen Fufa 64
#9 Wu Jun 54
#10 Xie Liangzhi 46

Latest patents

Publication Filing date Title
US2021125848A1 Methods and system for cleaning semiconductor wafers
JP2020039009A Substrate cleaning method
TW202034423A Method and apparatus for cleaning semiconductor wafer
TW202033837A Plating chuck
TW202031941A Electroplating apparatus for depositing metal on the entire substrate with high electroplating rate and uniform plated film
WO2020133149A1 Plating apparatus and plating method
TW202013550A Exhaust device has simple structure, low manufacture costs and less occupied spaces
TW202013595A Substrate cleaning device for enhancing cleaning effect of substrate using ultrasonic or megasonic device
TW202011473A Semiconductor substrate cleaning device for preventing acid or alkaline mist from corroding parts in cleaning chamber
SG11202011718XA Apparatus and method for cleaning semiconductor wafers
CN110512248A Electroplating device and electro-plating method
SG11202010652PA Methods and apparatus for cleaning semiconductor wafers
TW201945083A Device and method for performing wet treatment to semiconductor substrate capable of preventing high pressure liquid from splashing out of the processing chamber when high pressure liquid is evenly jetted on the semiconductor substrate
TW201945091A Apparatus and method for cleaning semiconducting silicon wafer capable of avoiding the pattern structure on the surface of the semiconductor silicon wafer from being damaged
KR20200118459A Substrate cleaning method and apparatus
CN111630649A Method and apparatus for cleaning substrate
CN111656484A Method and apparatus for cleaning substrate
TW201929140A Substrate supporting device preventing particles in the gap between the outer wall of the rotating shaft and the inner wall of the hollow shaft from entering the gas tank above the hollow shaft
US2018071795A1 Method for cleaning semiconductor wafers
WO2019095127A1 System for cleaning semiconductor wafers