Learn more

ASIA PACIFIC MICROSYSTEMS INC

Overview
  • Total Patents
    82
  • GoodIP Patent Rank
    96,959
  • Filing trend
    ⇩ 100.0%
About

ASIA PACIFIC MICROSYSTEMS INC has a total of 82 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2000. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets micro-structure and nano-technology, semiconductors and machines are SILEX MICROSYSTEMS AB, TOUCH MICRO SYSTEM TECH and INFINEON TECHNOLOGIES DRESDEN GMBH.

Patent filings in countries

World map showing ASIA PACIFIC MICROSYSTEMS INCs patent filings in countries
# Country Total Patents
#1 Taiwan 43
#2 United States 26
#3 China 12
#4 Japan 1

Patent filings per year

Chart showing ASIA PACIFIC MICROSYSTEMS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Li Jeng-Guo 17
#2 Yin Hung-Lin 13
#3 Tsai Shu-Huei 11
#4 Du Jeng-Shiun 8
#5 Lee Chengkuo 7
#6 Hsieh Jerwei 7
#7 Lin Tzung-Shian 6
#8 Tsai Shu-Hui 6
#9 Liu Ru-Mei 5
#10 Lin Chung-Hsien 5

Latest patents

Publication Filing date Title
TWI646597B Method for manufacturing piezoresistive pressure sensor and piezoresistive pressure sensor including a piezoresistive element unit forming step, a first cavity portion forming step, a region to be etched defining step, and a second cavity portion and a diaphragm forming step
TWI583931B Miniature piezoresistive pressure sensor formed with a piezoresistive region having a lower ion concentration and a conductive wire region having a higher ion concentration by ion implantation
US2015279664A1 Method for fabricating semiconductor devices having high-precision gaps
TW201632455A Micro-eletromechanical element using composite substrate and manufacturing method thereof
TW201631713A A method of manufacturing a microelement with a support structure
TW201604977A The fabrication of wafer - level package structure
TW201532153A An airtight wafer-level packaging method and an airtight wafer-level package structure made by the method thereof
CN103964372A Integrated micro electromechanical element and manufacturing method thereof
TW201516386A Pressure sensor with composite ranges
TW201431038A Integrated mems device and its manufacturing method
US2013285248A1 Package structure and substrate bonding method
TW201419563A Self-aligned vertical comb - shaped sensor and its manufacturing method
TW201413861A Wafer holding device
TW201334086A Monolithic compound sensor and its package
CN101633489A Induction component and microphone component of micro-electromechanical system
CN101633490A Component and component module provided with micro-cap, and wafer-level packaging methods thereof
TW200942487A Package body and package method for microsensor module
TW200919593A Elements and modules with micro caps and wafer level packaging method thereof
TW200840792A Sensing component of micro electro-mechanical system and component of microphone
TW200834711A Method of increasing etching rate in sacrificial layer