| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Germany | 4 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Canada | 2 | |
| #4 | China | 2 | |
| #5 | United States | 2 | |
| #6 | WIPO (World Intellectual Property Organization) | 2 | |
| #7 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Micro-structure and nano-technology | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Making microstructural devices | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Stieglauer Hermann | 8 |
| #2 | Behammer Dag | 8 |
| #3 | Behammer Dag Dr | 1 |
| #4 | Jonsson Guenter | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102018111200A1 | Method for producing an at least partially packaged semiconductor wafer | |
| DE102016123931A1 | Transistor | |
| DE102016123934A1 | Method for producing a transistor | |
| DE10039710A1 | Method for producing passive components on a semiconductor substrate |