AKRAM SALMAN has a total of 45 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are KIRBY KYLE K, MUTUAL PAK TECHNOLOGY CO LTD and ABBOTT DONALD C.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 45 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Audio-visual technology | |
#4 | Measurement | |
#5 | Environmental technology | |
#6 | Surface technology and coating | |
#7 | Electrical machinery and energy |
# | Name | Total Patents |
---|---|---|
#1 | Akram Salman | 45 |
#2 | Farnworth Warren M | 8 |
#3 | Wood Alan G | 8 |
#4 | Wark James M | 6 |
#5 | Rigg Sidney B | 5 |
#6 | Hiatt William M | 5 |
#7 | Hembree David R | 5 |
#8 | Kirby Kyle K | 4 |
#9 | Benson Peter A | 2 |
#10 | Hiatt William Mark | 2 |
Publication | Filing date | Title |
---|---|---|
US2009309142A1 | Imager devices having differing gate stack sidewall spacers, method for forming such imager devices, and systems including such imager devices | |
US2009231475A1 | Method and apparatus for breaking surface tension during a recessed color filter array process | |
US2007148807A1 | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers | |
US2006038172A1 | Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages | |
US2005275750A1 | Wafer-level packaged microelectronic imagers and processes for wafer-level packaging |