ADVANTEST AMERICA INC has a total of 16 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2005. It filed its patents most often in Taiwan, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets measurement, machines and surface technology and coating are NICTECH CO LTD, MULTITEST ELEKTRONISCHE SYST and CASCADE MICROTECH INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 8 | |
#2 | United States | 5 | |
#3 | WIPO (World Intellectual Property Organization) | 2 | |
#4 | Israel | 1 |
# | Industry | |
---|---|---|
#1 | Measurement | |
#2 | Machines | |
#3 | Surface technology and coating | |
#4 | Audio-visual technology | |
#5 | Semiconductors |
# | Name | Total Patents |
---|---|---|
#1 | Cros Florent | 6 |
#2 | Namburi Lakshmi | 4 |
#3 | Hu Ting | 4 |
#4 | Losey Matthew | 4 |
#5 | Desta Yohannes | 3 |
#6 | Namburi Lakshmikanth | 3 |
#7 | Leavy Montray | 2 |
#8 | Nim Tea | 1 |
#9 | Ismail Salleh | 1 |
#10 | Huang Chang | 1 |
Publication | Filing date | Title |
---|---|---|
US9678108B1 | Methods to manufacture semiconductor probe tips | |
US2014132298A1 | Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same | |
WO2013070201A1 | Fine pitch microelectronic contact array and method of making same | |
TW201118037A | Process for fabricating a multi-layer micro-electro-mechanical system and intermediary, multi-layered, metal complex to be used therein | |
TW201114679A | A superfilling secondary metallization process in mems fabrication | |
US2012032697A1 | Probe for testing semiconductor devices |