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ARVIN CHARLES L

Overview
  • Total Patents
    23
About

ARVIN CHARLES L has a total of 23 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, surface technology and coating and audio-visual technology are BASKER VEERARAGHAVAN S, HOUJIYOU TETSUYA and HOJO TETSUYA.

Patent filings in countries

World map showing ARVIN CHARLES Ls patent filings in countries
# Country Total Patents
#1 United States 23

Patent filings per year

Chart showing ARVIN CHARLES Ls patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Arvin Charles L 23
#2 Bezama Raschid J 10
#3 Semkow Krystyna W 9
#4 Sauter Wolfgang 7
#5 Cox Harry D 5
#6 Deligianni Hariklia 5
#7 Daubenspeck Timothy H 5
#8 Sullivan Timothy D 4
#9 Muzzy Christopher D 3
#10 Gambino Jeffrey P 3

Latest patents

Publication Filing date Title
US2014021607A1 Solder volume compensation with C4 process
US2014021606A1 Control of silver in C4 metallurgy with plating process
US2013299989A1 Chip connection structure and method of forming
US2013249066A1 Electromigration-resistant lead-free solder interconnect structures
US2012139113A1 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
US2012083113A1 Creation of lead-free solder joint with intermetallics
US2012043301A1 Method and apparatus for controlling and monitoring the potential
US2012043217A1 Rinsing and drying for electrochemical processing
US2012043216A1 Working electrode design for electrochemical processing of electronic components
US2010200271A1 Additives for grain fragmentation in Pb-free Sn-based solder
US2011193218A1 Solder interconnect with non-wettable sidewall pillars and methods of manufacture
US2011162876A1 Current spreading in organic substrates
US2010258940A1 Ball-limiting-metallurgy layers in solder ball structures
US2010258335A1 Structures for improving current carrying capability of interconnects and methods of fabricating the same
US2009174045A1 Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack
US2008179192A1 Multi-anode system for uniform plating of alloys