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Modules with integrated circuits and devices
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Particle capture using transfer stamp
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Surface-mountable pixel packages and pixel engines
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Components with backside adhesive layers
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Tiled displays with black-matrix support screens
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Printing component arrays with different orientations
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Chiplets with connection posts
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Micro-transfer printing with selective component removal
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Pixel modules with controllers and light emitters
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High-precision printed structures
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Printed components on substrate posts
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Rigid micro-modules with ILED and light conductor
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Pressure-activated electrical interconnection with additive repair
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Multi-level micro-device tethers
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iLED displays with substrate holes
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Micro-light-emitting-diode displays
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Multi-layer tethers for micro-transfer printing
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|
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|
Bezel-free displays
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LED optical components
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US2018007750A1
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Electrically parallel fused LEDs
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