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HARVATEK CO

Overview
  • Total Patents
    58
About

HARVATEK CO has a total of 58 patent applications. Its first patent ever was published in 2003. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, environmental technology and audio-visual technology are HEFEI SHIYA TECH CO LTD, VUEREAL INC and CHOI HEE-DONG.

Patent filings in countries

World map showing HARVATEK COs patent filings in countries
# Country Total Patents
#1 China 58

Patent filings per year

Chart showing HARVATEK COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Binglong Wang 52
#2 Fenghui Zhuang 22
#3 Shiyu Wu 13
#4 Wenkui Wu 11
#5 Songyi Xiao 10
#6 Zhengji Chen 7
#7 Huizhong Lin 5
#8 Huiyan Huang 4
#9 Chuanfa Lin 4
#10 Jiwen Hong 4

Latest patents

Publication Filing date Title
CN102479785A Light emitting structure with deposited type fluorescence covering layer and manufacturing method thereof
CN102454946A Lamp head component capable of adjusting light projecting direction in rotating mode and illuminating lamp tube
CN102345814A Simple detachable illuminating structure and illuminating light tube
CN102194967A Light-emitting diode (LED) packaging structure for promoting heat dissipation effect and manufacturing method thereof
CN102194966A Light-emitting diode (LED) structure with efficient heat dissipation effect and manufacturing method thereof
CN102136540A White LED (Light-Emitting Diode) encapsulation structure capable of improving illumination efficiency and manufacture method thereof
CN102136539A Wafer-level light emitting diode encapsulation structure and manufacturing method thereof
CN101777525A Luminous module group with high heat conductivity and light conductivity functions and application device
CN101996959A Chip encapsulation structure capable of realizing electrical connection without routing and manufacture method thereof
CN101996960A Chip encapsulating structure realizing electrical connection without routing and manufacturing method thereof
CN101859746A Conductive substrate structure for forming conductive channel by two-sided cutting and manufacturing method thereof
CN101685836A Manufacture method of wafer level upright type diode packaging structure
CN101650017A Lighting equipment with firefighting function
CN101645477A Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof
CN101630679A Luminous chip package structure with embedded static protective function and manufacturing method thereof
CN101599472A Semiconductor encapsulation structure with front face electricity conductivity but not base plate and producing method thereof
CN101599469A Semiconductor chip encapsulation structure with back surface electricity conductivity and producing method thereof
CN101272140A Press key, touching control panel and computer system capable of durably displaying functional graphic pattern
CN101587883A Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof
CN101567365A Light-emitting chip packaging structure with high-efficiency radiating substrate and method for packaging light-emitting chip