Learn more

WUXI SHIYI ELECTRIC POWER MACHINERY EQUIPMENT CO LTD

Overview
  • Total Patents
    20
About

WUXI SHIYI ELECTRIC POWER MACHINERY EQUIPMENT CO LTD has a total of 20 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are SHIMING CHEN, ADVANCED MATERIAL TECH CO LTD and TAIWAN MEMORY CORP.

Patent filings in countries

World map showing WUXI SHIYI ELECTRIC POWER MACHINERY EQUIPMENT CO LTDs patent filings in countries
# Country Total Patents
#1 China 20

Patent filings per year

Chart showing WUXI SHIYI ELECTRIC POWER MACHINERY EQUIPMENT CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Xu Daqiang 7
#2 Qin Linling 4
#3 Xin Jun 3
#4 Wang Peng 2
#5 Chen Pengtao 2
#6 Chen Haifeng 1
#7 Sun Huanjian 1
#8 Li Haifeng 1
#9 Pan Jinxiang 1

Latest patents

Publication Filing date Title
CN103083074A Internal fixing device of fracture of neck of femur
CN103089574A Exhaust silencer of air compressor
CN103083073A Fracture of tibial plateau internal fixing device
CN103083075A Pressurizing combination screw applied to radius and ulna backbone fracture
CN103094154A Semiconductor packaging system
CN103083079A Locking combination screw system
CN103083072A Screw applied to thighbone posterior condyle fractures
CN103083080A Internal fixation screw
CN103089573A Method for silencing air compressor
CN103083071A Spraying type internal fixation combination device applied to internal malleolus fractures
CN103066031A Coupling nodular technique applied before lead frame type product package
CN103065982A Process capable of improving package reliability of printed circuit board (PCB) substrate semiconductor
CN103065981A Coupling process applied to printed circuit board (PCB) semiconductor package
CN103066030A High reliability encapsulation
CN103065986A Semiconductor packaging technology capable of reducing humidity level
CN103065930A Composite plasma gas cleaning activation method
CN103065980A Lead frame type semiconductor package process
CN103065976A Surface processing method based on polychlorinated biphenyl (PCB) base plate
CN102354670A Comprehensive surface processing method for improving capsulation reliability of semiconductor
CN102412166A Surface nanofilm processing method prior to plastic packaging in semiconductor packaging