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Chip-packaging structure, chip bearing belt and flattening method thereof
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Thin membrane encapsulation structure of fingerprint identifying device
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Stack type chip package structure with wire frame inner pin installed with metal welding pad
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Stack type chip package with radiation structure
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Method for manufacturing non-exterior pin semiconductor packaging construction plated in sealing glue
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Wafer carrier and its encapsulation body
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Semiconductor encapsulation structure for improving wafer shift upon pressing
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Method for manufacturing probe card
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Chip packaging structure and manufacturing method thereof
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Semiconductor chip having minuteness space projection and its projection
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Crystal wafer testing method and structure of LED
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Method for manufacturing jet orifice piece
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