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WUXI CHINA RESOURCE MICRO ASSEMBLY TECH LTD

Overview
  • Total Patents
    65
  • GoodIP Patent Rank
    133,855
  • Filing trend
    ⇩ 100.0%
About

WUXI CHINA RESOURCE MICRO ASSEMBLY TECH LTD has a total of 65 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2009. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, machine tools and measurement are SHINKAWA KK, DONOFRIO MATTHEW and KAIJO KK.

Patent filings in countries

World map showing WUXI CHINA RESOURCE MICRO ASSEMBLY TECH LTDs patent filings in countries
# Country Total Patents
#1 China 65

Patent filings per year

Chart showing WUXI CHINA RESOURCE MICRO ASSEMBLY TECH LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Gong Ping 24
#2 Liu Xiaoming 21
#3 Wei Yuanhua 12
#4 Yang Wenbo 11
#5 Zheng Zhirong 8
#6 Wang Jianxin 8
#7 Wang Lunbo 8
#8 Wang Congliang 8
#9 Han Linsen 8
#10 Wu Jun 7

Latest patents

Publication Filing date Title
CN108878310A Chip cutting system and its control circuit
CN108872260A Wafer detects jig and wafer detecting apparatus
CN108878309A It is bonded pressing plate and bonding jig
CN108511355A Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment
CN107402345A Vacuum absorption device for chip testing devices
CN107369626A A kind of pasting method of multiclass cake core
CN107344339A Spliced material strip plate
CN107346763A A kind of lead frame of IPM modules
CN107336090A The method of saw blade secondary use
CN107356852A TSOT apparatus for testing chip
CN105185724A Cushion block and machine for mounting technology of flip chip, and method for upside-down mounting of chip
CN105197873A MEMS pressure sensor covering method and device
CN104835756A Discharging block used in chip packaging process
CN104717878A Device for SMT process and control method of device
CN104681476A Chip suction device and chip suction method
CN104681473A Transport track of semiconductor package device and semiconductor package device utilizing transport track
CN104670941A Splice type guide rail plate
CN104617010A Copper wire bonding press plate
CN104617074A Frame packaging structure and application method thereof
CN104591078A Dipping device for MEMS (Micro-Electro-Mechanical System) sensor and dipping method applied by dipping device