| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 5 | |
| #2 | China | 4 | |
| #3 | Japan | 2 | |
| #4 | Republic of Korea | 2 | |
| #5 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Measurement | |
| #3 | Electrical machinery and energy | |
| #4 | Micro-structure and nano-technology | |
| #5 | Biotechnology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hsu Tseng-Yang | 8 |
| #2 | Lam Cao Ngoc | 2 |
| #3 | Tseng Yang Hsu | 2 |
| #4 | Hsu Tseng Yang | 1 |
| #5 | Lai Chih-Hsiang | 1 |
| #6 | Lai Wen-Ching | 1 |
| #7 | Zengyang Xu | 1 |
| #8 | Lai Chih Hsiang | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW202023084A | Encoded microflakes | |
| TW201040103A | Micro-electro-mechanical systems interconnection pins and method for forming the same | |
| KR20100050419A | Probe assembly arrangement | |
| TW201007169A | Mems probe and the fabricaion method thereof | |
| TW200925105A | Method for fabricating a micro-electro-mechanical system part and apparatus with such part | |
| US2009191661A1 | Placing a MEMS part on an application platform using a guide mask |