Verfahren zur herstellung einer epitaktisch beschichteten halbleiterscheibe
US5487354A
Method for pulling a silicon single crystal
DE4414925A1
Process for the treatment of semiconductor material with an acidic liquid
DE4405829A1
Recovery of abrasive particles used to process semiconductor articles
DE4336704A1
Method and device for treating disc-shaped workpieces with a liquid
DE4325543A1
Process and apparatus for the wet chemical treatment of silicon material
DE4325518A1
Method for smoothing the edge of semiconductor wafers
DE4323793A1
Process for the production of rods or blocks from semiconductor material which expands on solidification by crystallizing a melt produced from granules, and device for carrying it out
DE4318184A1
Method and appliance for pulling single crystals
DE4316626A1
Method and device for dividing up semiconductor material
DE4316096C1
Process for the wet chemical treatment of disk-shaped workpieces
DE4314152A1
Device for eliminating the tendency to vibrate of a workpiece disk or tool carrier in machines for one-sided machining of the surfaces of semiconductor wafers
DE4309769A1
Method and appliance for reducing the incorporation of oxygen into a single crystal of silicon
DE4236827A1
Appts. for prodn. of semiconductor blocks - comprises casting mould with side walls and base, and heater to heat mould
DE4224395A1
Semiconductor wafers with defined ground deformation and process for their production
DE4223458A1
Reducing semiconductor material in size by shock thermal treatment - from super-heated steam or oxygen@-hydrogen@ gas flame within an evacuated chamber
DE4223020A1
Hydrogen fluoride recovery from sulphuric acid or gas contg. fluoride - by spraying acid in countercurrent to gas into reactor with various temp. zones and continuous discharge of gas and acid
DE4218283A1
Process for the contamination-free comminution of semiconductor material, in particular silicon
US5219613A
Process for producing storage-stable surfaces of polished silicon wafers
DE4209865A1
Process for improving the effectiveness of aqueous cleaning agents for removing metal-containing residues on semiconductor surfaces
