| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | Republic of Korea | 4 | |
| #3 | Taiwan | 4 | |
| #4 | China | 1 | |
| #5 | EPO (European Patent Office) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tsai Shiann-Tsong | 6 |
| #2 | Tsai Shiann Tsong | 4 |
| #3 | Cai Ming-Song | 3 |
| #4 | Hsu Hsieh-Wei | 2 |
| #5 | Kim Jin-Ho | 2 |
| #6 | Jang Eul-Chul | 2 |
| #7 | Tsai Ming-Sung | 2 |
| #8 | Tsai Shian-Tsung | 1 |
| #9 | Shiann-Tsong Tsai | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW201236090A | Method of fabricating semiconductor package structure | |
| US2009111221A1 | Fabrication method of semiconductor device | |
| US2008273299A1 | Memory card and method for fabricating the same | |
| TW200629436A | Chip package process | |
| TW200601521A | Stacking chip encapsulation structure | |
| TW200601508A | Stacking chip encapsulation structure with exposed bottom surface of lead frame |