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NIPPON INTER ELECTRONICS CORP

Overview
  • Total Patents
    388
  • GoodIP Patent Rank
    190,165
About

NIPPON INTER ELECTRONICS CORP has a total of 388 patent applications. Its first patent ever was published in 1984. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and measurement are GLOBAL ADVANCED PACKAGING TECH, THIN FILM MODULE INC and OKA SEIJI.

Patent filings in countries

World map showing NIPPON INTER ELECTRONICS CORPs patent filings in countries
# Country Total Patents
#1 Japan 388

Patent filings per year

Chart showing NIPPON INTER ELECTRONICS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Fukuda Eigo 37
#2 Senda Takao 23
#3 Fujimoto Shinji 23
#4 Nemoto Koji 19
#5 Shishido Choji 19
#6 Mitome Mitsuo 17
#7 Honda Akira 17
#8 Asakura Yoshiya 14
#9 Kaga Koji 14
#10 Sakamoto Hiroaki 14

Latest patents

Publication Filing date Title
JP2016181581A Semiconductor device
JP2016082056A Power module and power unit
JP2016062978A Power unit
JP2016058505A Power module and power unit
JP2016059120A Capacitor module and power unit
JP2015216148A Power semiconductor module
JP2015126039A Electric circuit board, and method for manufacturing electric circuit board
JP2015103540A Power semiconductor module
JP2015043396A Power semiconductor module
JP2015005580A Power semiconductor module and manufacturing method thereof
JP2014175545A Power semiconductor module
JP2014143282A Power semiconductor module
JP2014103342A Semiconductor device
JP2014103284A Power semiconductor module and manufacturing method of the same
JP2014036065A Power semiconductor module
JP2013239501A Power semiconductor module
JP2013175607A Schottky barrier diode
JP2013145831A Diode, semiconductor module and power circuit
JP2013135019A Resin-sealed power semiconductor module
JP2013131590A Resin sealed power semiconductor module and manufacturing method thereof