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UNITED SEMICONDUCTOR CORP

Overview
  • Total Patents
    188
About

UNITED SEMICONDUCTOR CORP has a total of 188 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, Taiwan and Germany. Its main competitors in its focus markets semiconductors, machines and measurement are CHARTERED SEMICONDUCTOR MFG, ZIPTRONIX INC and SEMIKRON GLEICHRICHTERBAU.

Patent filings in countries

World map showing UNITED SEMICONDUCTOR CORPs patent filings in countries
# Country Total Patents
#1 United States 130
#2 Taiwan 42
#3 Germany 5
#4 France 5
#5 Netherlands 4
#6 United Kingdom 2

Patent filings per year

Chart showing UNITED SEMICONDUCTOR CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hong Gary 50
#2 Chen Anchor 15
#3 Sheu Yau-Kae 13
#4 Chuang Shu-Ya 10
#5 Ko Joe 10
#6 Gau Jing-Horng 8
#7 Huang Hsiu-Wen 8
#8 Sze Jhy-Jyi 7
#9 Yu Chia-Chieh 7
#10 Lee Claymens 6

Latest patents

Publication Filing date Title
TW434908B Manufacturing method of metal oxide semiconductor transistor
TW434815B Manufacturing method of metal interconnects
US6221736B1 Fabrication method for a shallow trench isolation structure
TW437062B Manufacturing method for DRAM
TW436889B Method for removing a photoresist layer in a metallization process
TW434904B Method for reducing inverse narrow width effect
US6129108A Fluid delivering system
US6159808A Method of forming self-aligned DRAM cell
US6159840A Fabrication method for a dual damascene comprising an air-gap
US6214672B1 Method for manufacturing two-bit flash memory
US6136650A Method of forming three-dimensional flash memory structure
US6096623A Method for forming shallow trench isolation structure
US6077767A Modified implementation of air-gap low-K dielectric for unlanded via
US6187649B1 Shallow trench isolation process
TW426876B Exposure method of photomask and the pattern of the same
US6165895A Fabrication method of an interconnect
US6133143A Method of manufacturing interconnect
TW404015B The manufacturing method of interconnects
US6083825A Method of forming unlanded via hole
US6197673B1 Method of fabricating passivation of gate electrode